Siemens Xcelerator Technology Innovation Awards
Welcome to the most prestigious design contest in PCB—the 30th Technology Innovation Awards by Siemens! Started in 1988, and formerly known as Mentor’s Technology Leadership Awards, this program is the longest-running competition of its kind in the EDA industry. It recognizes engineers and CAD designers who use Siemens innovative technology to address today’s complex electronics systems design challenges and produce industry-leading products.
This year, entrants will be able to submit their design accomplishments in any of seven categories representing a wide variety of design types:
- Dense high-speed digital
- RF/microwave
- Power supply
- Mixed A/D/RF
- Device under test
- Back plane
- Multi-board system
Critical dates:
- Competition open: November 15th, 2023
- Competition close: February 19th, 2024
- Winners announced: July 23rd, 2024 - LinkedIn Event
Additional information about the contest can be found on the FAQ page. If you have any questions, send us an email.
Judges
Emeritus Judges
Rick Hartley
Principal Engineer — RHartley Enterprises
Steve Herbstman
PCB Design Consultant and Owner — SHLC
Happy Holden
Gentex Corporation (retired)
Andy Kowalewski
Senior Interconnect Designer (retired) - Metamako LP
Charles Pfeil
PCB Software Architect (retired)
Pete Waddell
Founder, PCB West and Printed Circuit Design magazine